IEEE Transactions on Components Packaging and Manufacturing Technology

SCI期刊JCR分区

SCI期刊JCR分区等级：2区

按学科分区

ENGINEERING, ELECTRICAL & ELECTRONIC

ENGINEERING, MANUFACTURING

MATERIALS SCIENCE, MULTIDISCIPLINARY

ENGINEERING, ELECTRICAL & ELECTRONIC

ENGINEERING, MANUFACTURING

MATERIALS SCIENCE, MULTIDISCIPLINARY

《新锐期刊分区表》（2026年3月发布）

大类学科

工程技术

3区

小类学科

工程：制造

4区

工程：电子与电气

3区

材料科学：综合

3区

Top期刊

否

综述期刊

否

最新中科院SCI期刊分区（2025年3月升级版）

大类学科

工程技术

3区

小类学科

工程：电子与电气

3区

材料科学：综合

3区

工程：制造

4区

Top期刊

否

综述期刊

否

期刊简介

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

出版信息

出版商

Institute of Electrical and Electronics Engineers Inc.

期刊官网

https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html

涉及的研究方向

ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

年文章数

255

出版国家或地区

UNITED STATES

是否OA

否

SCI期刊收录Coverage

Science Citation Index Expanded (SCIE) (2020年1月，原SCI撤销合并入SCIE，统称SCIE)

Scopus (CiteScore)

Cite Score（2025年最新版）

Cite Score	SJR	SNIP	排名
5.4	0.716	1.489	学科大类学科：Engineering 小类学科：Industrial and Manufacturing Engineering 分区 Q2 学科大类学科：Engineering 小类学科：Electrical and Electronic Engineering 分区 Q2 学科大类学科：Engineering 小类学科：Electronic, Optical and Magnetic Materials 分区 Q2