ARCHIVES OF MECHANICS
ARCHIVES OF MECHANICS
期刊ISSN: 0373-2029
E-ISSN: -
影响因子: 登录后查看数据
自引率: 8.3%
SCI期刊JCR分区
SCI期刊JCR分区等级:3区
按学科分区
MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Q3
MECHANICS
Q4
MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Q4
MECHANICS
Q4
《新锐期刊分区表》(2026年3月发布)
大类学科
工程技术
4区
小类学科
材料科学:表征与测试
4区
Top期刊
综述期刊
最新中科院SCI期刊分区(2025年3月升级版)
大类学科
工程技术
4区
小类学科
材料科学:表征与测试
4区
力学
4区
Top期刊
综述期刊
期刊简介
Archives of Mechanics provides a forum for original research on mechanics of solids, fluids and discrete systems, including the development of mathematical methods for solving mechanical problems. The journal encompasses all aspects of the field, with the emphasis placed on: -mechanics of materials: elasticity, plasticity, time-dependent phenomena, phase transformation, damage, fracture; physical and experimental foundations, micromechanics, thermodynamics, instabilities; -methods and problems in continuum mechanics: general theory and novel applications, thermomechanics, structural analysis, porous media, contact problems; -dynamics of material systems; -fluid flows and interactions with solids. Papers published in the Archives should contain original contributions dealing with theoretical, experimental, or numerical aspects of mechanical problems listed above. The journal publishes also current announcements and information about important scientific events of possible interest to its readers, like conferences, congresses, symposia, work-shops, courses, etc. Occasionally, special issues of the journal may be devoted to publication of all or selected papers presented at international conferences or other scientific meetings. However, all papers intended for such an issue are subjected to the usual reviewing and acceptance procedure.
出版信息
出版商
Polish Academy of Sciences
涉及的研究方向
工程技术-材料科学:表征与测试
刊期
Bimonthly
年文章数
23
出版国家或地区
POLAND
是否OA
Cite Score(2025年最新版)
Cite Score SJR SNIP 排名
1.7 0.259 0.479
学科
大类学科:Engineering
小类学科:Mechanical Engineering
分区
Q3
学科
大类学科:Engineering
小类学科:Condensed Matter Physics
分区
Q4
SCI期刊投稿推荐
JCR分区相关期刊
中科院分区相关期刊
推荐会议
查看更多>
去登录