会议详情

2023 IEEE 6th International Conference on Electrical, Electronics and System Engineering (ICEESE)

2023年IEEE第六届电气、电子和系统工程国际会议(ICEESE)


Important Dates:

Paper Submission Deadline:15th July 2023

 Notification of Acceptance:15th July 2023

Date of the meeting:29th – 30th August 2023

Location:Kuala Lumpur, Malaysia

 

Conference introduction:

It is our esteemed pleasure to officially announce the convening of the 2023 IEEE 6th International Conference on Electrical, Electronics, and System Engineering (ICEESE) in Best Western I-City, Shah Alam, Selangor, Malaysia from August 29th to 30th, 2023. The conference shall be organized under the auspices of the IEEE Malaysia Education Society, and co-organized by the Engineering and Technical Research Group (EnTER), School of Electrical Engineering, College of Engineering, Universiti Teknologi MARA, Malaysia, while receiving technical co-sponsorship from Harbin Institute of Technology, China. This conference shall be a milestone event in the post-pandemic era, fostering opportunities for scholars and researchers worldwide to converge and deliberate on cutting-edge innovations and advancements in the field of electrical, electronics, and system engineering.


The proceedings of ICEESE 2023 may be eligible for inclusion in the IEEE Xplore® Digital Library, once they meet the requirements of an IEEE quality review.


Organizing Committee:

CHAIR

Norlida Buniyamin 

CO-CHAIR

Nina Korlina Madzhi

SECRETARY

Nurfadzilah Ahmad

FINANCE

Adizul Ahmad 

LOCAL ARRANGEMENT

A’zraa Afhzan Ab Rahim 

TECHNICAL PROGRAMME

Ng Kok Mun

PUBLICATION

Nina Korlina Madzhi

Noor Ezan Abdullah 

WEBSITE & PUBLICITY

Norashikin M. Thamrin


Call for Papers:

Authors are invited to submit full papers describing original research. Areas of interest include, but are not limited to the following topics:


Bioinstrumentation: Sensors, Micro, Nano, and Wearable Technologies

Circuits and Electronics; Electronic Medical Devices

Mobile Computing Multimedia Services and Technologies

Networks Design, Protocols and Management Optical Electronic Devices & Photonics

Radio-Frequency Integrated Circuits; Robotics System

Systems on Chips and Network on Chips

Analysis of Power Quality and System Stability

Antenna and Propagation

Bioinformatics & Biomedical Imaging

Electromagnetic and Photonics

Expert System

Deep Learning

Machine Language

Image Processing

Biomedical Signal Processing

Parallel Programming & Processing

Power Electronics

Remote Control and Technique of GPS

Computer-Aided Design, Manufacturing, and Engineering

Fault Detection and Diagnosis in Systems

Globalization of Engineering Microsystems Integration


Contact Us:

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