个人简述:

周永存，博士，副教授。2014年9月毕业于西安交通大学，获工学博士学位。2013年1月至2014年1月于美国佐治亚理工学院(Georgia Tech)从事电子封装复合材料的研究，师从“现代电子封装之父”C. P. Wong 教授。2014年9月特评副教授进入西工大材料学院工作，主要从事聚合物基纳米复合封装材料及其相变机理研究。已在国际期刊权威期刊上发表SCI论文30余篇，包括Nature旗下综合期刊Scientific Reports, Applied Physics Letter等，已授权发明专利3项。

科研工作:

主要研究的方向有聚合物基封装复合材料，相变储能复合材料及纳米材料长大共生行为及其应用等。 近几年代表性成果：☆ 论文[1]  Zhou YC, Liu F. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings. Applied Physics Letters, 2016, 109: 082901.[2]  Zhou YC, Luo ZP, Zhuang X, Liu F. Multilayer-structured high-performance nanocomposites based on a combination of silver nanoparticles and nanowires. Materials Letters, 2016, 182: 323-327.[3]  Zhou YC, Liu F, Wang H. Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review. Polymer Composites, 06/2015 DOI:10.1002/pc.23641.[4]     Zhou YC, Yao YG, Chen CY, Moon K, Wang H and Wong CP. The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation. Scientific Reports, 2014, 4: 4779. [5]     Zhou YC, Wang H, Xiang F, Zhang H, Yu K and Chen L. A poly(vinylidene fluoride) composite with added self-passivated microaluminum and nanoaluminum particles for enhanced thermal conductivity. Applied Physics Letters, 2011, 98(18): 182906.[6]     Zhou YC, Wang L, Zhang H, Bai YY and Wang H. Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO2 nanoparticle fillers. Applied Physics Letters, 2012, 101(1): 012903. [7]     Zhou YC, and Wang H. An Al@Al2O3@SiO2/Polyimide composite with multilayer coating structure fillers based on self-passivated aluminum cores. Applied Physics Letters, 2013, 102(13): 132901.[8]     Zhou YC, Bai YY, Yu K, Kang Y and Wang H. Excellent thermal conductivity and dielectric properties of polyimide composites filled with silica coated self-passivated aluminum fibers and nanoparticles. Applied Physics Letters, 2013, 102(25): 252903. [9]     Zhou YC, Wang H, Wang L, Yu K, Lin ZD, He L and Bai YY. Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging. Materials Science and Engineering B, 2012, 177(11): 892-896. [10]  Zhou YC, Chen YN, Wang H and Wong CP. Creation of a multilayer aluminum coating structure nanoparticle polyimide filler for electronic applications. Materials Letters, 2014, 119: 64-67.[11]  Bai YY, Jiang YH, Chen BH, Foo CC, Zhou YC, Xiang F, Zhou JX, Wang H and Suo ZG. Cyclic performance of viscoelastic dielectric elastomers with solid hydrogel electrodes, Applied Physics Letters, 2014, 104(6): 062902. [12]   Li y, Shu LL, Zhou YC, Guo J, and Wang H. Enhanced flexoelectric effect in a non-ferroelectric composite, Applied Physics Letters, 2013, 103(14): 142909.[13]  Yu K, Bai YY, Zhou YC, Niu Y, and Wang H. Poly(vinylidene fluoride) polymer based nanocomposites with enhanced energy density by filling with polyacrylate elastomers and batio3 nanoparticles, Applied Physics Letters, 2014, 104(8): 082904. [14]   Yu K, Niu Y, Bai YY, Zhou YC, and Wang H. Poly(vinylidene fluoride) polymer based nanocomposites with significantly reduced energy loss by filling with core-shell structured BaTiO3/SiO2 nanoparticles. Applied Physics Letters, 2013, 102(10): 102903.[15]   Yu K, Wang L, Zhou YC, Bai YY and Wang H. Enhanced dielectric properties of BaTiO3/poly(vinylidene fluoride) nanocomposites for energy storage applications. Journal of Applied Physics, 2013, 113(3): 034105.[16] Yu K, Niu Y, Zhou YC, and Wang H. Nanocomposites of surface-modified BaTiO3 nanoparticles filled ferroelectric polymer with enhanced energy density. Journal of The American Ceramic Society, 2013, 96(8): 2519-2524. [17] Yu K, Niu Y, Xiang F, Zhou YC, Bai YY and Wang H. Enhanced electric breakdown strength and high energy density of barium titanate filled polymer nanocomposites. Journal of Applied Physics, 2013, 114(17): 174107. ☆  专利[1]     汪宏, 周永存, 向锋, 李可铖, 喻科, 陈惠如. 聚合物基复合材料及其制造方法. 中国发明专利: zl 201110054346.6[2]     向锋, 汪宏, 李可铖, 刘维红, 喻科, 周永存. 一种核壳结构填料聚合物基复合材料及其制备方法. 中国发明专利：zl 200910218645.1 [3]     汪宏, 周永存, 向锋, 喻科, 王鲁. 一种聚合物基复合材料及其制备方法. 中国发明专利: 201210182048.x[4]     汪宏, 喻科, 牛玉娟, 周永存, 陈惠如. 聚合物基复合材料及其制备方法. 中国发明专利: 201310115602.7[5]     刘峰, 周永存, 罗正平, 庄晓. 一种聚合物基复合材料及其制备方法. 中国发明专利: 201610537556.3

教育背景:

2014.09-至今 西北工业大学 副教授     2014.09  毕业于西安交通大学微电子学与固体电子学专业获工学博士学位     2013.01 - 2014.01  美国佐治亚理工学院（Georgia Tech）（联合培养）     2008.07  毕业于西安电子科技大学材料科学与工程专业获工学学士学位