教授
何宝凤
  • 所属院校:
    北京工业大学
  • 所属院系:
    机电学院
  • 研究领域:
    1.材料表面二维和三维粗糙度的测量和表征2.激光(excimerlaser)的微纳加工。3.复合材料的制备和相关性能的检测与分析。
  • 职称:
    教授
  • 导师类型:
    硕导
  • 招生专业:
    仪器科学与技术
个人简介

科研工作:

近5年代表论文——1.Baofeng He, Jon Petzing, Patrick Webb, Richard Leach. Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters. Optics and Lasers in Engineering. 75 (2015) 39–47. (IF: 2.237)2.Hui Xie, Lanying Zhang, Wanshu Zhang, Baofeng He et al. Electro-switchable characteristics of broadband absorptive films based on multi-dichroic dye-doped nematic liquid crystal. Liquid Crystals, 2015, Vol. 42, No. 3, 309–315 (IF: 2.486)3.B. He, D. P. Webb, J. Petzing and R. Leach. Improving Plated Copper Adhesion for Metallization of Glass PCBs. ICEPT-HDP2011, pp.284-288,2012. ISBN:978-1-4577-1768-0. (SCI检索号:000309781000061;EI 检索号:20114714539846)4.B. He, J. N. Petzing, D. P. Webb, P. P. Conway and R. Leach. The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. NPL report ENG 34, Queen’s Printer and Controller of HMSO, 2012, ISSN:1754-2987.(SCI检索号:13477428)5.B. He, J. N. Petzing, D. P. Webb,P. P. Conway and R. Leach. The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. Euspen 12th International Conference, pp.92-95, 2012. ISBN: 978-0-9566790-0-0, Oral presentation.6.B. He, J. N. Petzing, D. P. Webb and P. P. Conway. The use of areal parameters to improve electroless copper plating bond strength on glass substrates. 13th International Conference on Metrology and Properties of Engineering Surfaces, pp.108-112, 2011. ISBN: 978-0946754-59-5.


教育背景:

2002/09 – 2006/07,哈尔滨工业大学,金属材料工程系,获得学士学位。2006/09 – 2009/01,哈尔滨工业大学,材料科学与工程系,获得硕士学位。2009/04 – 2012/06,英国Loughborough University,机械制造与工程系,获得博士学位。

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