JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS
期刊ISSN: 0923-8174
E-ISSN: 1573-0727
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自引率: 7.7%
SCI期刊JCR分区
SCI期刊JCR分区等级:4区
按学科分区
ENGINEERING, ELECTRICAL & ELECTRONIC
Q4
ENGINEERING, ELECTRICAL & ELECTRONIC
Q4
《新锐期刊分区表》(2026年3月发布)
大类学科
工程技术
4区
小类学科
工程:电子与电气
4区
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综述期刊
最新中科院SCI期刊分区(2025年3月升级版)
大类学科
工程技术
4区
小类学科
工程:电子与电气
4区
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综述期刊
期刊简介
The Journal of Electronic Testing: Theory and Applications is an international forum for the dissemination of research and application information in the area of electronic testing. This is the only journal devoted specifically to electronic testing. The papers for publication in Journal of Electronic Testing: Theory and Applications are selected through a peer review to ensure originality, timeliness, and relevance. The journal provides archival material, and through its quick publication cycle, strives to bring recent results to researchers and practitioners. While it emphasizes publication of preciously unpublished material, conference papers of exceptional merit that require wider exposure are, at the discretion of the editors, also published provided they meet the journal's peer review standard. Journal of Electronic Testing: Theory and Applications also seeks clearly written survey and review articles to promote improved understanding of the state of the art. Journal of Electronic Testing: Theory and Applications coverage includes, but is not limited to the following topics: Testing of VLSI devices printed circuit boards, and electronic systems; Testing of analog and digital electronic circuits; Testing of microprocessors, memories, and signal processing devices; Fault modeling; Test generation; Fault simulation; Testability analysis; Design for testability; Synthesis for testability; Built-in self-test; Test specification; Fault tolerance; Formal verification of hardware; Simulation for verification; Design debugging; AI methods and expert systems for test and diagnosis; Automatic test equipment (ATE); Test fixtures; Electron Beam Test Systems; Test programming; Test data analysis; Economics of testing; Quality and reliability; CAD Tools; Testing of wafer-scale integration devices; Testing of reliable systems; Manufacturing yield and design for yield improvement; Failure mode analysis and process improvement
出版信息
出版商
Springer US
涉及的研究方向
工程技术-工程:电子与电气
刊期
Bimonthly
年文章数
53
出版国家或地区
UNITED STATES
是否OA
Cite Score(2025年最新版)
Cite Score SJR SNIP 排名
2.4 0.316 0.789
学科
大类学科:Engineering
小类学科:Electrical and Electronic Engineering
分区
Q3
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